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Original
Quality
Seller Reliability
Model: E900N
Adopts high-quality 3D NAND wafer-level chip
Form Factor: M.2 2280
Interface: PCIe Gen 3.0 x 4
Memory Component: 3D TLC
Capacity: 256GB
Sequential R/W:
Up to 2000 MB/s Up to 1250 MB/s
MTBF: 1,500,000 hours
Physical Specification:
Dimension: 80.0 mm × 23.0 mm × 4.8 mm (3.15" × 0.91" × 0.19")
Weight: Max 8 g (0.02 lb)
Temperature:
Operating Temperature: 0°C to +70°C (+32°F to +158°F)
Storage Temperature: –40°C to +85°C (–40°F to +185°F)
Shock resistance: 1500G/0.5 ms (half sine wave)